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Heat Transfer PCM

F&D Company’s HTPCM series is a thermal conductive phase change material. A phase-change material (PCM) is a substance with a high heat of fusion which, melting and solidifying at a certain temperature, is capable of storing and releasing large amounts of energy. Heat is absorbed or released when the material changes from solid to liquid and vice versa. Solid–liquid PCMs behave like sensible heat storage (SHS) materials; their temperature rises as they absorb heat. When PCMs reach the temperature at which they change phase (melting temp 50℃) they absorb large amounts of heat at an almost constant temperature. Thermal conductive PCM offers high thermal conductivity and easy handling that allows more control in the manufacturing environment comparable to thermal grease.
• Composition
- Organic binders : a blend of a polymer, low-melt-point crystalline component(such as a wax)
- Fine particle ceramic or metal fillers : Aluminum, Al2O3, BN, AlN, ZnO, etc(for thermal enhancement)

Concept

• Phase change material appears to be like any normal thermal pad at room temperature.
• Heated to 50° C, it transforms into a liquid to fill in any gaps between the heat sink and the
    heat source before becoming a solid again after cooling.
• It’s great for ensuring that even spaces with irregular shapes will be covered completely without
    the chance of leaving air gaps.
• PCM’s provided an alternative to the messy application and the migration problems associated
    with thermal grease.

Features & Benefit

Paste or Sheet type
Screen printable Thermal Interface Material
High Thermal conductivity 3.5~5.5W/mK
Very Low Thermal Impedance 0.004℃-in2/W@50psi (Paste)
Phase change temperature 50℃

Application

∙ LED Lamp
∙ Notebook PC
∙ Memory Modules
∙ Automotive
∙ Between other heat-generating devices and chassis.

Please contact us for any detailed information or specific needs.